技术资料 Data
MTP1306的技术资料
来源:汕头市创世纪电子发展有限公司; (2009/4/16 15:50:25)
MTP1306的产品特征:
• Avalanche Energy Specified
• Source–to–Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature
以上信息由『维库电子开发网』(www.weeqoo.com)整理。
MTP1306的技术参数:
This document contains information on a new product. Specifications and information herein are subject to change without notice.
E–FET and HDTMOS are trademarks of Motorola, Inc.
资料整理:维库电子开发网(www.weeqoo.com),的芯片PDF资料基地。
MTP1306的产品描述:
This advanced high–cell density HDTMOS power FET is designed to withstand high energy in the avalanche and commutation modes. This new energy efficient design also offers a drain–to–source diode with a fast recovery time. Designed for low voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating area are critical and offer additional safety margin against unexpected voltage transients.
• Avalanche Energy Specified
• Source–to–Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature
以上信息由『维库电子开发网』(www.weeqoo.com)整理。
MTP1306的技术参数:
Rating |
Symbol |
Value |
Unit |
Drain–to–Source Voltage |
VDSS |
300 |
Vdc |
Drain–to–Gate Voltage (RGS = 1.0 MΩ) |
VDGR |
300 |
Vdc |
Gate–to–Source Voltage — Continuous — Non–Repetitive (tp ≤10 ms) |
VGS VGSM |
± 20 ± 20 |
Vdc Vpk |
Drain Current — Continuous — Continuous @ @TC=100°C — Single Pulse (tp ≤ 10 μs) |
ID ID IDM |
75 59 225 |
Adc Apk |
Total Power Dissipation Derate above 25°C |
PD |
150 1.2 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
–55 to 175 |
°C |
Single Pulse Drain–to–Source Avalanche Energy TJ = 25°C (VDD =25Vdc,VGS = 10Vdc, Vdc,Peak IL =75Apk, L = 0.1mH, RG = 25Ω) |
EAS |
280 |
mJ |
Thermal Resistance — Junction to Case — Junction to Ambient |
RθJC RθJA |
0.8 62.5 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |
E–FET and HDTMOS are trademarks of Motorola, Inc.
资料整理:维库电子开发网(www.weeqoo.com),的芯片PDF资料基地。
MTP1306的产品描述:
This advanced high–cell density HDTMOS power FET is designed to withstand high energy in the avalanche and commutation modes. This new energy efficient design also offers a drain–to–source diode with a fast recovery time. Designed for low voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating area are critical and offer additional safety margin against unexpected voltage transients.
版权所有:深圳市创世纪伟业科技发展有限公司
粤ICP备13047036号-1 友情链接
后台管理